Multi Response Optimization of ECDM Process Parameters for Machining of Microchannel in Silica Glass Using Taguchi–GRA Technique

نویسندگان

چکیده

In this work, machining of microchannel in silica glass was successfully carried out using electro chemical discharge (ECDM) process. The experiments were planned according to L27 orthogonal array with applied voltage, stand-off distance (SOD), electrolyte concentration, pulse frequency and pulse-on-time (TON) as control factors. material removal rate (MRR), overcut (OC) tool wear (TWR) considered response characteristics. study the effects parameters on MRR, OC TWR have been investigated. increase concentration time lead improvement output characteristics which is attributed formation heavily crowded hydrogen bubbles further coalescence promotes occurrence sparks resulted higher values TWR. multi-objective optimization ECDM through grey relational analysis (GRA) method. Optimal combination process achieved from GRA 45 V 25 wt.% 1.5 mm SOD, 400 Hz ?s TON. ANOVA for GRG revealed that voltage (70.33%) most significant factor affecting responses followed by (11.69%), (4.98%) SOD (4.13%). Furthermore, regression equations formulated optimum predict collaboration higher-order parameters. addition, confirmation test conducted optimal setting comparison experimental results exhibited a good agreement predicted values. microstructural observation machined surface out.

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ژورنال

عنوان ژورنال: Silicon

سال: 2021

ISSN: ['1876-9918', '1876-990X']

DOI: https://doi.org/10.1007/s12633-021-01167-4